GRAIN BOUNDARY SLIDING AND INTRAGRANULAR SLIP MEASUREMENT IN-SITU DURING CREEP [Poster #11]
Benjamin ElbrechtGrand Ballroom D
Creep in future long-term space technology materials is a critical concern due to the duration of potential missions to Mars and beyond. Structural and skin components in long-term mission spacecraft will undergo creep deformation and eventual failure if not designed to be sufficiently creep resistant. The microstructural deformation mechanisms that control the creep behavior must be understood to intelligently inform the design of new creep resistant alloys and enhance those already in service. Using lightweight single phase β Ti alloys, an analysis tool was developed to measure grain boundary sliding (GBS) and intragranular slip in-situ via a Heaviside function-based algorithm. The data needed for the analysis tool includes an electron backscattered diffraction generated microstructural map and high-resolution digital image correlation (HRDIC) strain fields. This testing technique advances the state of the art by facilitating in-situ measurement of these microstructural deformation mechanisms without the need to interrupt creep testing and introduce unwanted thermic cyclic effects. Proof-of-concept experiments utilizing this analysis tool on a single phase β Ti alloy in room temperature creep rapidly identified the dominant deformation mechanism to be intragranular slip and glide creep without the need for destructive and expensive post-mortem testing.