S06: Microstructures and Fracture in Advanced Materials


Advanced materials may have excellent mechanical, thermal, magnetic and/or electrical properties and are widely used in aerospace, mechanical engineering, energy storage and transfer, medical equipment and other fields. In applications, advanced materials such as single crystals, ceramics, alloys, polymers and nanostructured materials may have mechanical and/or electrical failures under external loads, in which microstructure plays an important role. Therefore, it is of scientific significance and practical importance to understand the microstructure evolution and its effect on the fracture of advanced materials under an external field. The purpose of the symposium is to provide a forum for scientists and engineers from academia, research laboratories, and industry from all over the world who are involved in the field of microstructures and fracture in advanced materials to exchange ideas and to extend further cooperation among participants. This is a symposium on microstructures and fracture in advanced materials and related topics, with particular focus on the following, but not limited to them:

  1. Materials/mechanics informatics for microstructure evolution and fracture of advanced materials
  2. Phase field modeling of microstructure evolution and crack propagation of advanced materials
  3. Finite element and other continuum methods on microstructure and fracture of advanced materials
  4. The influence of microstructures and phase transition on fracture and failure of advanced materials
  5. Other topics related to the microstructures and fracture of advanced materials.


Tong-Yi Zhang (Hong Kong University of Science and Technology (Guangzhou) and Shanghai University, Email: zhangty@shu.edu.cn)

Chad Landis (University of Texas at Austin, Email: landis@utexas.edu)

Weiqiu Chen (Zhejiang University, Email: chenwq@zju.edu.cn)

Ralf Müller (Technische Universität Darmstadt, Email: ralf.mueller@mechanik.tu-darmstadt.de)

Jie Wang (Zhejiang University, Email: jw@zju.edu.cn)


Tong-Yi Zhang (zhangty@shu.edu.cn)